发明名称 CASING, MODULE SUBSTRATE, AND AIR-COOLING SYSTEM
摘要 A casing in which a module substrate is to be enclosed, the casing includes a rail portion that slidably supports the module substrate, and a shutter portion provided so as to open and close an opening for ventilation. The casing includes a pin portion that is provided in the rail portion and contacts an edge of the module substrate while the module substrate is supported by the rail portion. The casing includes a link mechanism that allows the shutter portion to move in accordance with the moving distance of the pin portion.
申请公布号 US2013140968(A1) 申请公布日期 2013.06.06
申请号 US201213660211 申请日期 2012.10.25
申请人 FUJITSU LIMITED;FUJITSU LIMITED 发明人 NAGAHORI KAZUO
分类号 H05K5/02;H05K7/20 主分类号 H05K5/02
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