| 摘要 |
<p>The present invention provides an active chip package substrate and a preparation method of the substrate. The active chip package substrate comprises: a core board; at least one upper active chip, embedded in the core board and having an active surface facing a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing an upper surface of the core board, the lower active chip being an active bare chip. In the active chip package substrate and the preparation method of the substrate according to the present invention, the active chip is not packaged before being embedded, and is thinned, so that a package structure is miniaturized and the weight of the package structure is lightened, thereby simplifying the substrate manufacturing process and improving the production efficiency. Moreover, in the present invention, a plurality of active bare chips is embedded on both sides of the substrate at the same time, thereby improving the integration level. Meanwhile, a great deal of freedom and space are provided at both sides of the substrate, and multi-layer wiring can be performed continuously, thereby improving the process quality and reliability of electrical connection.</p> |
