发明名称 Method for assembling LEDs to a ceramic heat conductive piece and a structure produced by the method
摘要 A method for assembling LEDs to a ceramic heat conductive piece comprises: mixing ceramic materials together and subjecting the mixed ceramic materials to hot pressing to form the ceramic heat conductive piece, the ceramic heat conductive piece has a cold end; subjecting the cold end of the ceramic heat conductive piece to sliver printing, drying process and silver reduction process to form the silver layer; choosing conductive binders, and applying the conductive binders to the silver layer by coating process; attaching the LEDs between paired conductive binders by welding; getting a finished product. The structure produced by the method is such that the LEDs are located between the paired conductive binders, and each of the LEDs includes a LED wafer disposed on a substrate, so that the heat generated by the LEDs can be transmitted quickly to the ceramic heat conductive piece via the conductive binders and the silver layer.
申请公布号 US2013141910(A1) 申请公布日期 2013.06.06
申请号 US201113310765 申请日期 2011.12.04
申请人 LIAO TZU-YU 发明人 LIAO TZU-YU
分类号 F21V29/00;C04B41/51;F21V21/00;H01L21/64;H01R43/02 主分类号 F21V29/00
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