| 摘要 |
PURPOSE: An underfill material is provided to decrease difference of thermal response behavior of a semiconductor device and an object, thereby manufacturing a semiconductor device with high reliability. CONSTITUTION: An underfill material satisfies storage elasticity(E')[MPa] after a thermal curing treatment at 175 °C for 1 hour and satisfies a thermal expansion coefficient[ppm/K] of E'×α<250000[Pa/K] at 25 °C. The storage elasticity(E') is 100-10,000pMPa. The thermal expansion coefficient is 10-200 [ppm/K]. The underfill material includes a thermoplastic resin and a thermosetting resin. The thermosetting resin includes an acryl resin. The thermosetting resin includes an epoxy resin and a phenol resin. |
