发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and apparatus capable of machining a secondary patterning line with high speed and accuracy based on a primary patterning line formed on a workpiece. <P>SOLUTION: The laser beam machining apparatus scans a laser beam on a workpiece (1), forming a secondary patterning line at a prescribed position, with the primary patterning line formed on the workpiece used as a reference. The scanning position of the laser beam can be corrected based on: a laser optical system for scanning a laser beam using a galvano scanning mirror (14) to the machining surface of the workpiece; an image pickup means (17) for picking up an image of the primary patterning line and laser reflected light on the machining surface of the workpiece; a compensation amount detecting means (21) which detects a relative position of the primary patterning line and the laser reflected light on the image picked up by the image pickup means and which detects an amount of compensation by comparing the relative position detected and the prescribed position of the secondary patterning line with the primary patterning line used as a reference; and based on the amount of the compensation. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP5201311(B2) 申请公布日期 2013.06.05
申请号 JP20070083831 申请日期 2007.03.28
申请人 发明人
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/06;B23K26/08;B23K101/42;G02B26/10 主分类号 B23K26/00
代理机构 代理人
主权项
地址