| 摘要 |
The imaging device has an electronic sensor chip (1) with an optically active surface. The electronic sensor chip is electrically connected with a printed circuit board (13). The imaging device has an objective (21) which is arranged in an objective carrier (20). The position and inclination of the objective to a bearing surface (23) of the objective carrier are defined, and the bearing surface of the objective carrier lies flat on the sensor chip such that an imager surface (7) is not covered by the bearing surface. |
