Wire saw device and method for operating same

摘要

A wire saw device for sawing semiconductor material is provided, the wire saw device comprising a wire guide device (110) adapted to guide a wire for forming at least one wire web (200) for sawing the semiconductor material, and at least one wire management unit (130) for providing a wire to the wire guide device, wherein the wire guide device (110) and the at least one wire management unit (130) are adapted to provide the at least one wire web such that an effective cutting area of 12 m 2 /h or more is provided.