| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition low in viscosity, excellent in workability, good in adhesion and besides low in elastic modulus, and to provide a semiconductor device excellent in the reliability of soldering crack resistance and the like by using the liquid resin composition as a die attaching material for semiconductors or an adhesive for heat radiation members. SOLUTION: The liquid resin composition is the one for pasting a semiconductor element or heat radiation member on a support. It is characterized by containing, as the essential components, a filler (A), a thermosetting resin (B) containing a compound (B1) having two glycidyl groups in one molecule and a compound (B2) having two (meth)acryloyl groups in one molecule, and an additive (C). COPYRIGHT: (C)2008,JPO&INPIT |
