Laser drilling of through boreholes without internal protection

摘要

The Trepanier method of producing a through-hole (25) in a wall (10) of a hollow component by a millisecond laser and a nanosecond laser having short laser pulses of 0.1-0.3 ms, a relatively high pulse frequency of 20-30 Hz and very low energy of 2-3 Joules and adapting a focus position (13) of the laser beam, is claimed. A maximum of 10% of the thickness of the wall of the hollow component is removed, and an overlying area is removed with high energy, pulse durations and/or higher frequencies with a difference of 20%. The through-hole is produced in a cavity (4) behind the wall. The Trepanier method of producing a through-hole (25) in a wall (10) of a hollow component by a millisecond laser and a nanosecond laser having short laser pulses of 0.1-0.3 ms, a relatively high pulse frequency of 20-30 Hz and very low energy of 2-3 Joules and adapting a focus position (13) of the laser beam, is claimed. A maximum of 10% of the thickness of the wall of the hollow component is removed, and an overlying area is removed with high energy, pulse durations and/or higher frequencies with a difference of 20%. The through-hole is produced in a cavity (4) behind the wall. The focus of the laser beam is present in the through-hole on a surface of region to be removed.