<p>A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer.</p>
申请公布号
EP2598286(A2)
申请公布日期
2013.06.05
申请号
EP20110760557
申请日期
2011.07.22
申请人
MEMC ELECTRONIC MATERIALS, INC.
发明人
ZHANG, GUOQIANG, DAVID;VANDAMME, ROLAND;ALBRECHT, PETER, D.