发明名称 METHOD OF MANUFACTURING PHASE CHANGE MEMORY DEVICE
摘要 <p>PURPOSE: A method for manufacturing a phase change memory device is provided to prevent the misalignment of an upper electrode and a phase change material layer by self-aligning the upper electrode and the phase change material layer. CONSTITUTION: A diode(121) and a first interlayer insulating layer(120) are formed on a substrate(110). A preliminary lower electrode layer and a preliminary interlayer insulating layer are formed on the first interlayer insulating layer. A first mask pattern and a second mask pattern are formed on the preliminary interlayer insulating layer. The preliminary interlayer insulating layer and the preliminary lower electrode layer are etched to form a storage element structure using the second mask pattern. A storage device(ST) is formed by successively laminating the storage element structure, a lower electrode layer(150), a phase change material layer(160), and an upper electrode layer(170).</p>
申请公布号 KR20130059088(A) 申请公布日期 2013.06.05
申请号 KR20110125212 申请日期 2011.11.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH, GYU HWAN;PARK, DOO HWAN
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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