| 摘要 |
There is provided a method of manufacturing a camera module including a sensor package having an image pickup element, and a lens configuration in which a lens holder, and a receptacle accommodating the sensor package are integrally formed, the sensor package being fixed within the receptacle, the method including: applying a photo-curing resin to predetermined portions of the receptacle; performing alignment of a relative position of the sensor package to the lens configuration; a first joining whereby the photo-curing resin is cured so that the sensor package is fixed within the receptacle while maintaining the relative position of the sensor package to the lens configuration; and a second joining whereby a thermosetting resin is applied so as to fill a space formed between the sensor package and the lens configuration, and then curing the thermosetting resin. |
