发明名称 |
HEAT DISSIPATING WIRING BOARD AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A heat dissipating wiring board comprises: a metal wiring plate with a circuit pattern formed therein: a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed; and a heat dissipating plate arranged on an under surface of the filler containing resin layer, wherein the circuit pattern is formed of a through groove provided in the metal wiring plate, and this through groove is made up of: a fine groove that opens at the top surface of the metal wiring plate; and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to a dust or the like in a space of the through groove.</p> |
申请公布号 |
EP2006909(B1) |
申请公布日期 |
2013.06.05 |
申请号 |
EP20070745152 |
申请日期 |
2007.06.13 |
申请人 |
PANASONIC CORPORATION |
发明人 |
TSUMURA, TETSUYA;NISHIYAMA, HIROHARU;TSUJIMOTO, ETSUO |
分类号 |
H01L23/36;H01L23/12;H05K1/02;H05K3/06;H05K3/08 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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