发明名称 Method of fabricating heavily doped region in double-diffused source MOSFET (LDMOS) transistor
摘要 A transistor includes a source, a drain and a gate. The source includes a p-doped p-body, a p+ region overlapping the p-body, an n+ region overlapping the p-body in proximity to the p+ region, and an n-doped source, heavily double-diffused (SHDD) region, only into the source region of the transistor, the SHDD region having a depth about equal to that of the first n+ region and overlapping the first n+ region. The drain includes a second n+ region and an n-doped shallow drain overlapping the second n+ region. The gate includes a gate oxide and a conductive material over the gate oxide. The SHDD region extends further laterally than the first n+ region beneath the gate oxide. The SHDD region is implanted using a dopant concentration greater than that of the n-doped shallow drain but less than that of the first n+ region.
申请公布号 US8455340(B2) 申请公布日期 2013.06.04
申请号 US201113184333 申请日期 2011.07.15
申请人 ZUNIGA MARCO A.;YOU BUDONG;VOLTERRA SEMICONDUCTOR CORPORATION 发明人 ZUNIGA MARCO A.;YOU BUDONG
分类号 H01L21/425;H01L21/04;H01L21/336 主分类号 H01L21/425
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