| 摘要 |
PURPOSE: An apparatus for mounting semiconductor chips are provided to be easily controllable according to various conditions. CONSTITUTION: A pick and place system(4) includes a single bonding head(5). A pickup head(7) and a support table(8) are mounted on a carriage(6). The carriage reciprocates between a first position and a second position. A first camera(10) photographs a semiconductor chip(12) arranged on a wafer table(1). A second camera(11) photographs the semiconductor chip arranged on the support table. A control unit(9) adjusts the pick and place system to align the semiconductor chip on a substrate(2). |
