发明名称 METHOD AND DEVICE FOR DIVIDING BRITTLE MATERIAL SUBSTRATE
摘要 PURPOSE: A dividing method and dividing equipment of a brittle material substrate is provided to perform a break and a scribe during one process by forming a scribe line accompanying a vertical crack reaching to the other side of the substrate. CONSTITUTION: A dividing method and dividing equipment of a brittle material substrate comprise the following steps. Information related to a brittle material substrate(107) is inputted. A scribing wheel(115) corresponded to the information on the brittle material substrate is selected to hold a scribing wheel on the top of a scribe head(112). A scribe load is selected corresponded to the information on the brittle material substrate. The scribing wheel is pushed to the surface of the brittle material substrate to perform full cut by moving the scribe head and the brittle material substrate relatively. The scribe line formed on the step accompanies a vertical crack reaching to the other side of the brittle material substrate. Brittle material substrate dividing equipment(100) comprises a substrate support device, a scribe head, a transport means, and a controller.
申请公布号 KR20130058594(A) 申请公布日期 2013.06.04
申请号 KR20120112131 申请日期 2012.10.10
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 MAEKAWA KAZUYA
分类号 C03B33/033;B26D3/08;B28D5/00 主分类号 C03B33/033
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