发明名称 |
Method of manufacturing light emitting diode packaging lens and light emitting diode package |
摘要 |
A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
|
申请公布号 |
US8455910(B2) |
申请公布日期 |
2013.06.04 |
申请号 |
US20090585642 |
申请日期 |
2009.09.21 |
申请人 |
CHIANG CHUNG-I;LU TSAN;LIN HUNG-YI;HO HSIEN-LUNG;WALSIN LIHWA CORPORATION |
发明人 |
CHIANG CHUNG-I;LU TSAN;LIN HUNG-YI;HO HSIEN-LUNG |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|