发明名称 LIGHT EMITTING DEVICE PAKAGE
摘要 PURPOSE: A light emitting device package is provided to improve reliability by growing a GaN based semiconductor layer on the non-polar or the anti-polar surface of a substrate. CONSTITUTION: A package body(110) includes a cavity. A first, a second, and a third light emitting device(130,140,150) are arranged in the bottom surface of the cavity. The first, the second, and the third light emitting device have different peak wavelengths. A first light emitting device is grown to have the non-polar or the anti-polar surface. The peak wavelength of the first light emitting device is 500-560 nm.
申请公布号 KR20130058233(A) 申请公布日期 2013.06.04
申请号 KR20110124134 申请日期 2011.11.25
申请人 LG INNOTEK CO., LTD. 发明人 YUN, HYEONG SEON;SHIM, HEE JAE;LEE, EUN DK
分类号 H01L33/48;H01L33/16 主分类号 H01L33/48
代理机构 代理人
主权项
地址