发明名称 Laser processing method, laser processing device and cable harness production method
摘要 The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.
申请公布号 US8455791(B2) 申请公布日期 2013.06.04
申请号 US20090397490 申请日期 2009.03.04
申请人 TAMAOKI SHINOBU;KAKUI MOTOKI;NAKAMAE KAZUO;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 TAMAOKI SHINOBU;KAKUI MOTOKI;NAKAMAE KAZUO
分类号 B23K26/00 主分类号 B23K26/00
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