发明名称 |
Method for manufacturing light emitting diode |
摘要 |
A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages. |
申请公布号 |
US8455274(B2) |
申请公布日期 |
2013.06.04 |
申请号 |
US201113286090 |
申请日期 |
2011.10.31 |
申请人 |
CHEN PIN-CHUAN;LIN HSIN-CHIANG;TSENG WEN-LIANG;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHEN PIN-CHUAN;LIN HSIN-CHIANG;TSENG WEN-LIANG |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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