ADHESIVE FILM AND ENCAPSULATION METHOD OF ORGANIC ELECTRONIC DEVICE USING THE SAME

摘要

PURPOSE: An adhesive film is provided to effectively block moisture and oxygen flowing from the outside to an organic electronic device, and to improve lifetime and durability of the organic electronic device. CONSTITUTION: An adhesive film comprises a curable resin and a moisture absorbent(13). The adhesive includes a first region(12a) which is in contact with an organic electronic device, and a second region(12b) which is not in contact with the organic electronic device. The first region and the second region include 0-20% and 80-100% of moisture absorbent, respectively based on the total weight of the moisture absorbent in the adhesive. An encapsulating method of the organic electronic device comprises a step of applying the adhesive to a substrate to enable the first region to cover the organic electronic device; and a step of curing the adhesive.