发明名称 METALLIC PASTE COMPOSITION FOR FORMATION OF AN ELECTRODE COMPRISING AG-COATED POWDERS AND ELECTRODES USING THE SAME
摘要 PURPOSE: A metallic paste composition for forming an electrode is provided to prevent degradation of electrical performance and physical performance regardless of decreasing silver content. CONSTITUTION: A metallic paste composition for forming an electrode comprises 20-60 wt% of plate type silver powder(100); 0.1-25 wt% of plate type copper, nickel, or aluminum powder(200) coated with the silver; 5-20 wt% of organic vehicles; and 10-60 wt% of solvent. The silver powder has an average particle size of 5-20 um and a thickness of 500 nm or less. The copper, nickel, or aluminum powder has an average particle size of 5-30 um and a thickness of 1 um or less.
申请公布号 KR20130058206(A) 申请公布日期 2013.06.04
申请号 KR20110124090 申请日期 2011.11.25
申请人 KOLONGLOTECH. INC. 发明人 KIM, SOO HEON;PARK, JAE KUK;HWANG, BO CHUL
分类号 H01B1/22;H01B1/16;H01J9/02;H01J17/04 主分类号 H01B1/22
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