发明名称 |
METALLIC PASTE COMPOSITION FOR FORMATION OF AN ELECTRODE COMPRISING AG-COATED POWDERS AND ELECTRODES USING THE SAME |
摘要 |
PURPOSE: A metallic paste composition for forming an electrode is provided to prevent degradation of electrical performance and physical performance regardless of decreasing silver content. CONSTITUTION: A metallic paste composition for forming an electrode comprises 20-60 wt% of plate type silver powder(100); 0.1-25 wt% of plate type copper, nickel, or aluminum powder(200) coated with the silver; 5-20 wt% of organic vehicles; and 10-60 wt% of solvent. The silver powder has an average particle size of 5-20 um and a thickness of 500 nm or less. The copper, nickel, or aluminum powder has an average particle size of 5-30 um and a thickness of 1 um or less. |
申请公布号 |
KR20130058206(A) |
申请公布日期 |
2013.06.04 |
申请号 |
KR20110124090 |
申请日期 |
2011.11.25 |
申请人 |
KOLONGLOTECH. INC. |
发明人 |
KIM, SOO HEON;PARK, JAE KUK;HWANG, BO CHUL |
分类号 |
H01B1/22;H01B1/16;H01J9/02;H01J17/04 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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