PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME

摘要

PURPOSE: A printed circuit board for a semiconductor package and a manufacturing method thereof are provided to make the height of a pump even by forming a metal bump on a copper foil of a carrier. CONSTITUTION: A first solder resist layer(120) is formed on one side of a base substrate. A second solder resist layer is formed on the other side of the base substrate. A first connection pad(141) is buried in the first solder resist layer. A second connection pad(143) is buried in the second solder resist layer. A metal bump(150) is formed in a part of the first connection pad.