METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to simplify a manufacturing process by forming a U-shaped lead in a semiconductor package. CONSTITUTION: Leads are arranged on a first plane(S11). The leads are shaped(S12). The leads are fixed to the upper surface of a lead fixing unit(S13). The first area of the lead is electrically connected to a semiconductor die(S14). The semiconductor die and the lead are molded(S15). [Reference numerals] (AA) Start; (BB) End; (S11) Arrange multiple leads; (S12) Bend the multiple leads; (S13) Fix the multiple leads on the upper surface of a lead fixing unit; (S14) Connect a semiconductor die; (S15) Mold; (S16) Cut the outer lead(selective)