METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to prevent the separation of a lead by forming a U-shaped lead structure in a mold structure. CONSTITUTION: Leads are arranged on a first plane(S11). The leads are shaped(S12). Each lead is fixed by using a second region of the lead(S13). A semiconductor die and a part of the first and second regions of the lead are molded(S14). The second part of the lead is bent(S15). [Reference numerals] (AA) Start; (BB) End; (S11) Arrange multiple leads; (S12) First forming bending the multiple leads; (S13) Fix the multiple leads; (S14) Connect and mold a semiconductor die; (S15) Second forming; (S16) Cut