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发明名称
用以结合互连件至电路元件之方法及系统
摘要
本说明书系有关于一种结合一互连件至一高密度电路元件之系统及方法。
申请公布号
TWI397971
申请公布日期
2013.06.01
申请号
TW094110479
申请日期
2005.04.01
申请人
惠普研发公司 美国
发明人
麦尔 尼尔W. MEYER, NEAL W. US;海利克森 罗纳德A. HELLEKSON, RONALD A. US;颜奇克 罗尼J. YENCHIK, RONNIE J. US
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
恽轶群 台北市松山区南京东路3段248号7楼;陈文郎 台北市松山区南京东路3段248号7楼
主权项
地址
美国
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