POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS

摘要

Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described. In an example, a polishing pad for polishing a semiconductor substrate includes a homogeneous polishing body. The homogeneous polishing body includes a thermoset polyurethane material and a plurality of closed cell pores disposed in the thermoset polyurethane material. The plurality of closed cell pore has a multi-modal distribution of diameters.