ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

摘要

AN ADHESIVE FILM FOR SEMICONDUCTOR, WHICH COMPRISES AT LEAST ONE RESIN LAYER A, AND, AFTER BONDED TO A LEAD FRAME, HAS AT 25°C A 90°-PEEL STRENGTH OF AT LEAST 5 N/m BETWEEN THE RESIN LAYER A AND THE LEAD FRAME, AND, AFTER A LEAD FRAME IS BONDED TO THE ADHESIVE FILM FOR SEMICONDUCTOR AND SEALED WITH A SEALING MATERIAL, HAS AT A TEMPERATURE RANGING FROM 0 TO 250°C A 90°-PEEL STRENGTH OF AT MOST 1000 N/m BETWEEN THE RESIN LAYER A AND EACH OF THE LEAD FRAME AND THE SEALING MATERIAL; A LEAD FRAME AND A SEMICONDUCTOR DEVICE USING THE ADHESIVE FILM FOR SEMICONDUCTOR; AND A METHOD OF PRODUCING A SEMICONDUCTOR DEVICE.