PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent spread of plating by using a first solder resist and a second solder resist. CONSTITUTION: An outer circuit layer(170) is formed on the top of a base substrate. The outer circuit layer includes a connection pad. A first solder resist(180) is formed on the top of the base substrate. A second solder resist(190) is formed on the top of the outer circuit layer. The second solder resist exposes the connection pad.