| 摘要 |
PURPOSE: An oven for manufacturing a semiconductor package is provided to open and close a chamber by using a sliding door, to minimize the occupation space, and to secure a compact size. CONSTITUTION: An oven(110) includes a heating unit. A chamber(120) is installed on the front side of the oven to receive hot air from the heating unit. A sliding door(130) opens and closes the chamber. A loading unit(140) supplies a magazine having half-finished products of semiconductor packages into the oven. An unloading unit(150) discharges the magazine having cured half-products of the semiconductor packages to the outside. |
