The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.
申请公布号
SG189029(A1)
申请公布日期
2013.05.31
申请号
SG20130020615
申请日期
2011.09.23
申请人
SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
发明人
HETZLER, KEVIN, G.;MCCOY, JESSICA, L.;CONLEY, KAREN, M.;DICORLETO GIBSON, JULIA;LEMBERGER, MICHAEL , J.