SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICONDUCTOR DIE USING THE SAME

摘要

W2011067581 SEMICONDUCTOR DIE PICKUP DEVICE AND SEMICONDUCTOR DIE PICKUP METHO Page I of I D:eika PATENTSCOPESearch /alai national and Not I Patent ',IITranslate Options News LoginThrnsA !P P F:NIPAVVIPPCr:1. (W02012043057) SEMICONDUCTOR DIE PICKUP DEVICE AND SEMICONDUCTOR DIE PICKUP METHOD USING S•E Pub. No.: WO/20121043057 International Application No.: PCT/JP20111057581Publication Date: 05.04.2012 International Filing Date: 01.08.2011 sheet (12) into the open suction aperture (41 and steadily peeling the retaining sheet 812) away from the semiconductor die (15).(FR)L'invention concerne un dispositif de amassage de puces semi-conductrices qui comprend : un plateau (20) ; un orifice d'aspiration (41 , un couvercle (23) qui ouvre et ferme I orifice d aspiration (41) des saillies (31, 32) positionnees sur I peripherie de (orifice d'aspiration (41) et depassant d'une face de contact (22) ; et des trous de base a-33d). Lors du ramassage dune puce semi-conductrice (15), avec au moms une partie de l'exterieur e la puce semi-conductrice (15) soulevee par cheque saillie (31, 32) vers la peripherie externe du pi au. Line feuille de maintien (12) de la partie soulevee eat aspiree par les trous de base (33a-33d), l'extr ite avant (23a) du couvercle (23) est tendue vers le haut, comprimant lafeuille de maintien (12) et la ce semi-conductrice (15), tandis qua le couvercle (23) glisse, ouvrant de fawn reguliere l'onfice d'a siration (41), aspirant de region reguliere la feuille de maintien (12) dans 'orificed'aspiration (41) ouvert decollant de facon regullere a feuille de maintien (12) data puce semi conductrice (15).(JA) ag"--')(20) IR3Ittgo(41),IRIINHQ(41)trogIng(23) a la o (41)0mm:eat"4-6 (31) (32)Lgt?-1.(33a)—(33d)e, UM. SW120.4 (1S) EI•tig7ant eRlz, ItY-1(15)04f1M1.114—F-(1 2) D1A311-i6Lttlz, (2 3)08trA (23 ait>-1-(12)Lt141*Y4(15)Leck.±1147'si(IN(23)X541:(41)t.lickrni, Not:0131M (41)1:181-1-(12)IIIMR31-ffi*410Y4(15)75‘(12)flICMPletoDesignated AE, AG L, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, 13W, BY, BZ, CA, CH, CL, CN, CO CR, CU, CZ, States: DE, D•, DM, DO, DZ, EC, EE, EG, ES, F1, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG,KM, N, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA,N , NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH,TM, TN, TR, TI', TZ, UA, UG, US, UZ, VC, VN, LA, ZM, ZW.African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SO, SL, SZ, TZ, UG, ZM, ZVV)Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, Fl, FR, GB, GR, HR, HU, 1E, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, FR)African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, Cl, CM, GA, GN, GO, GW, ML, MR, NE, SN, TD, TG).ublication Language: Japanese (JA)SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICONDUCTOR DIE USING THE SAMEProvided is a semiconductor die pick-up apparatus including a stage (20), a suction opening (41), a cover (23) that opens and closes a suction opening (41), and projections (31) and (32) and primary holes (33a) to (33d) arranged at a circumferential edge of the suction opening(41) and project from a contact surface (22). When picking up a semiconductor die (15), in a state in which at least a portion of a contour of the semiconductor die (15) sticks out from the projections (31) and (32) toward the outer circumference of the stage, a retaining sheet (12) at the portion sticking out from the primary holes (33a) to (33d) is suctioned, a tip end (23a) of the cover (23) is caused to advance upward, the cover (23) is caused to slide while pushing the retaining sheet (12) and the semiconductor die (15) upward to open the suction opening (41) sequentially, the opened suction opening (41) is caused to suction the retaining sheet (12) sequentially to separate the retaining sheet (12) from the semiconductor die (15).Figures 10A, 102, 10C