PROCESS OF FABRICATING A CIRCUIT BOARD

摘要

A PROCESS FOR FABRICATING A CIRCUIT BOARD INCLUDES: PROVIDING A SUBSTRATE (10) INCLUDING A FIRST ELECTRICALLY CONDUCTIVE CORE (12) HAVING A FIRST INSULATING COATING ON A FIRST SIDE AND A SECOND INSULATING COATING ON A SECOND SIDE, FORMING AN OPENING (22) IN THE FIRST AND SECOND INSULATING COATINGS (14, 16) AND THE FIRST ELECTRICALLY CONDUCTIVE CORE, EXPOSING AN EDGE OF THE CONDUCTIVE CORE WITHIN THE OPENING (22), AND ELECTRODEPOSITING A THIRD INSULATING MATERIAL ON THE EXPOSED EDGE OF THE FIRST ELECTRICALLY CONDUCTIVE CORE. A CIRCUIT BOARD FABRICATED USING THE PROCESS IS ALSO PROVIDED.