| 摘要 |
<P>PROBLEM TO BE SOLVED: To precisely print a print solder ball in the cause of a recent trend of miniaturization of a solder bump formed at an electrode part of a semiconductor chip, with a solder ball also being miniaturized when printing is performed using the solder ball. <P>SOLUTION: A filling head for solder ball printing secures a squeegee holder at each surface of an octagonal fixing member provided to a rotating shaft. The squeegee holder is attached with a slit squeegee made from a plurality of line materials. By moving the filling head while rotating the rotational shaft and while being pressed against a mask surface under a predetermined pressing force, the solder ball is efficiently filled in a mask opening part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
