| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a dicing frame which provides facilities for handling properties and workability by reduction in the weight, prevents foreign matters from adhering to a substrate, prevents the peeling of a dicing tape 10, and can improve productivity. <P>SOLUTION: In a method for manufacturing a dicing frame 1 which is formed of a molding material containing a resin into a substantially ring-shaped flat plate in plan view capable of storing a semiconductor wafer W, and in which a dicing tape 10 having a substrate layer 11 coated with an acrylic adhesive 12 is stuck to a rear surface 6 thereof, the molding material is prepared by kneading and mixing a nylon (R) resin and a glass fiber or an aluminum borate whisker, a surface tension value of a wet reagent according to JIS K 6768 (ISO8296) obtained by injection molding of the dicing frame 1 by the molding material is set at 35-50 mN/m, and a bending elastic modulus of the dicing frame 1 according to ASTM D790 is set at 25 GPa or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
