发明名称 HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE WITH IMPROVED BREAKDOWN VOLTAGE PERFORMANCE
摘要 A high electron mobility transistor (HEMT) includes a silicon substrate, an unintentionally doped gallium nitride (UID GaN) layer over the silicon substrate. The HEMT further includes a donor-supply layer over the UID GaN layer, a gate structure, a drain, and a source over the donor-supply layer. The HEMT further includes a dielectric layer having one or more dielectric plug portions in the donor-supply layer and top portions between the gate structure and the drain over the donor-supply layer. A method for making the HEMT is also provided.
申请公布号 US2013134435(A1) 申请公布日期 2013.05.30
申请号 US201213650610 申请日期 2012.10.12
申请人 COMPANY, LTD. TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 YU CHEN-JU;HSIUNG CHIH-WEN;YAO FU-WEI;HSU CHUN-WEI;WONG KING-YUEN;YU JIUN-LEI JERRY;YANG FU-CHIH
分类号 H01L29/778;H01L21/338;H01L29/20 主分类号 H01L29/778
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