发明名称 DEVICE AND METHOD FOR CUTTING BRITTLE PLATE-LIKE OBJECT
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting method by which, when a brittle plate-like object is divided into a product portion and a non-product portion along a scheduled cutting line as a boundary, probability of formation of microdefects in the product portion is made as low as possible. <P>SOLUTION: The cutting device 1 irradiates a brittle plate-like object A (laminate 10) supported horizontally from below by a supporting member 4 with a laser beam LB along a scheduled cutting line CL of the laminate 10, and divides the laminate 10 into a product portion M and a non-product portion N along the scheduled cutting line CL as a boundary. The supporting member 4 includes a first supporting portion 6 and a second supporting portion 7 capable of supporting the product portion M and the non-product portion N, respectively. The supporting surface 6a of the first supporting portion 6 constituting the supporting member 4 is located above the supporting surface 7a of the second supporting portion 7, and cutting along the scheduled cutting line CL is completed while locating the product portion M above the non-product portion N. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013103852(A) 申请公布日期 2013.05.30
申请号 JP20110247451 申请日期 2011.11.11
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 MORI HIROKI
分类号 C03B33/08;B23K26/00;B23K26/10;B23K26/38;G02F1/13 主分类号 C03B33/08
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