发明名称 |
SILICA-BASED PARTICLE WITH MOISTURE RESISTANCE, METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR SEALING RESIN COMPOSITION CONTAINING THE PARTICLE, AND SUBSTRATE WITH COATING FILM FORMED USING THE RESIN COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition formable of a coating film which ensures little variation of its relative dielectric constant and little variation of its dielectric loss tangent under high temperature and high humidity conditions, by improving the compressive strength and moisture resistance of silica-based particles having a cavity inside, and to provide a substrate capable of retaining high moisture resistance for a long time. <P>SOLUTION: Silica-based particles have a cavity on the inside of a nonporous shell silica layer, and have a void fraction in the range of 20-95 vol.% and an average particle diameter in the range of 0.1-50 μm. The cavities of the silica-based particles have negative pressure of ≤133 hPa. The silica-based particles have compressive strength in the range of 0.1-200 kgf/mm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013103850(A) |
申请公布日期 |
2013.05.30 |
申请号 |
JP20110247143 |
申请日期 |
2011.11.11 |
申请人 |
JGC CATALYSTS & CHEMICALS LTD |
发明人 |
ARAO HIROKI;ARAGANE HIROTADA;KOYANAGI TSUGUO |
分类号 |
C01B33/18;C08K3/36;C08L101/00;C09D7/12;C09D201/00 |
主分类号 |
C01B33/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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