| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a double sided wiring circuit board which inhibits bubbles occurring during etching resist formation, easily inhibits the residual resist occurring during the removal of the resist, and further improves the yield compared to a prior art, and to provide a manufacturing method of the double sided wiring circuit board. <P>SOLUTION: A double sided wiring circuit board 100 includes: an insulative base material 1; conductor patterns 13 formed on both surfaces of the insulative base material 1; a through hole 4 penetrating through the insulative base material 1 and the conductor patterns 13; a conduction layer inner wall part 9 formed on an inner wall surface 4a of the through hole 4; and a conduction layer peripheral part 8 formed on at least an upper surface of the conductor pattern 13 so as to continue into the conduction layer inner wall part 9. The conduction layer peripheral part 8 has a cutout part 7 formed from the through hole 4 outward along the surface direction of the insulative base material 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
