| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately determine joining conditions during heating and pressure bonding of electronic components. <P>SOLUTION: A first electronic component 6 and a second electronic component 7 are heated and pressure-bonded to each other with an adhesive film 1 interposed therebetween, which contains a plurality of metal particles 3 different in solidus temperature and particle diameter. Joining conditions during heating and pressure bonding are determined by observing molten states of the metal particles 3 in the adhesive film 1 after heating and pressure bonding. <P>COPYRIGHT: (C)2013,JPO&INPIT |
