| 摘要 |
There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O(1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.
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