| 摘要 |
The invention relates to a cooling box (1) for electric or electronic components, consisting of a material. Said cooling box (1) is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity (4) that is enclosed by the material, said cavity (4) being closed or provided with at least one opening (2). To improve thermal dissipation, at least one surface region of the cooling box (1) is defined by functions of electrical and/or thermal conductivity. |
