| 摘要 |
The invention provides a semiconductor yield management system. The system comprises an electronic data collection module and an execution module, the execution module comprises a plurality of execution sub-modules in sequence to perform executions on an object successively, the of the execution sub-modules comprises an execution section and an inspection section; the execution section of the execution sub-module is connected with the inspection section of the preceding execution sub-module except for the first execution sub-module; the inspection section of the execution sub-module is connected with the execution section of the subsequent execution sub-module except for the last execution sub-module; the inspection module of the execution sub-module is connected with the electronic data collection module. According to the semiconductor yield management system, the potential not-good wafers can be recorded, analyzed and distributed to the corresponding execution module, which realizes the risk minimization.
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