发明名称 Resin Mold, Production Method Thereof, and Use Thereof
摘要 A resin mold includes a resin layer having a depressions and protrusions pattern formed in the surface thereof, and a release layer including a mold release agent and formed of uniform thickness on at least the depressions and protrusions pattern of the aforementioned resin layer. The aforementioned resin layer has a solvent soluble resin, and an additive that has bleeding ability with respect to the solvent soluble resin, has a substituent group capable of coupling with the aforementioned mold release agent, and has a substituent group having compatibility with the aforementioned solvent soluble resin. The aforementioned additive is localized in the vicinity of the aforementioned resin layer surface. The group of the additive capable of coupling with the mold release agent condenses with the aforementioned mold release agent so that the aforementioned resin layer and release layer are bonded together.
申请公布号 US2013134622(A1) 申请公布日期 2013.05.30
申请号 US201113814310 申请日期 2011.08.03
申请人 UEHARA SATOSHI;MIZAWA TAKAHIDE;SOKEN CHEMICAL & ENGINEERING CO., LTD. 发明人 UEHARA SATOSHI;MIZAWA TAKAHIDE
分类号 B29C59/00 主分类号 B29C59/00
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