| 摘要 |
An LED package is provided, which includes a base, a lighting device, and a sealing material. The lighting device is disposed on the base. The sealing material is disposed on the lighting material, and the out surface of the sealing material includes a plurality of micro-structures. The micro-structures comprise of protruded micro-structures, depressed micro-structures or any combination thereof. At least of a partial of a light from the lighting element is transmitted to an ambient through the micro-structure.
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