| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce manufacturing processes by arranging and fixing electronic devices and a second substrate on the lower side of a first substrate. CONSTITUTION: A plurality of electronic devices(1) are mounted on both sides of a first substrate(10). The first substrate includes a mounting electrode(13), a circuit pattern(15), and a conductive via(14). The electronic device includes a passive device(1a) and an active device(1b). A second substrate(20) is arranged on the lower side of the first substrate and is combined with the first substrate. The second substrate includes an electrode pad(24) and a conductive via(25). |
