| 摘要 |
The present invention relates to a layer composite (10), in particular for connecting electronic components (11, 12) comprising at least one compensation layer (40), at least two bonding layers (30) and at least two connection layers (20), wherein the compensation layer (40) is formed from aluminium or molybdenum, an aluminium or molybdenum alloy, from a metal-matrix material composed of aluminium and silicon carbide or composed of aluminium and copper-carbon, or from a copper-molybdenum alloy. A bonding layer (30) made of a precious metal is applied to at least two opposite sides of the compensation layer (40), and a connection layer (20) is applied to each bonding layer (30), the connection layers (20) being formed from sinterable and/or sintered metal powder. The layer composite (10) can be applied to a matrix film (50), particularly as a plurality of individual sinterable molded parts (10a, 10b, 10c, 10d,...). The invention further relates to a method for forming a layer composite (10) according to the invention and to a circuit arrangement (100) containing a layer composite (10) according to the invention. |
