发明名称 COPPER PARTICLE DISPERSION, CONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a formulation for a copper particle dispersion comprising dispersed copper particles. <P>SOLUTION: The copper particle dispersion has copper particles, at least one dispersion medium which contains the copper particles, and at least one dispersant for dispersing the copper particles in the dispersion medium. The copper particles have a median particle diameter of greater than or equal to 1 nm and less than 100 nm. The dispersion medium is a polar dispersion medium. The dispersant is a compound having at least one acidic functional group and a molecular weight of 200 to 100,000, or a salt thereof. By this configuration, the dispersant is compatible with the dispersion medium, and, because the surface of the copper particles is covered by dispersant molecules, the copper particles are dispersed in the dispersion medium. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013104089(A) 申请公布日期 2013.05.30
申请号 JP20110248126 申请日期 2011.11.14
申请人 ISHIHARA CHEM CO LTD;APPLIED NANOTECH HOLDINGS INC 发明人 KAWATO YUICHI;MAEDA YUSUKE;KUDO TOMIO
分类号 B22F9/00;B82Y30/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 主分类号 B22F9/00
代理机构 代理人
主权项
地址