发明名称 SUBSTRATE TRANSFER APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that a transfer mechanism and a flip mechanism are respectively provided at independent chambers and thus multiple chambers are required resulting in the increase of the footprint. <P>SOLUTION: A substrate transfer apparatus 1 includes: a transfer mechanism 2 moving a substrate 90 in the transfer direction and a flip mechanism 3 vertically flipping the substrate 90. The transfer mechanism 2 includes a transfer arm 14 which slides the substrate 90 in the transfer direction, and the flip mechanism 3 includes: an upper chuck part 34 pressing the substrate 90 from above when the substrate 90 is flipped; a lower part chuck 35 supporting the substrate 90 from below when the substrate 90 is flipped; and a rotation shaft 32 pivotably supporting the upper part chuck 34 and the lower part chuck 35 so that the upper part chuck 34 and the lower part chuck 35 rotate in the vertical direction. The transfer mechanism 2 and the flip mechanism 3 are fixed and supported by one support base 5. The transfer mechanism 2 and the flip mechanism 3 are provided at the same chamber and thereby reducing the number of needed chambers and areas for disposing the chambers. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013105859(A) 申请公布日期 2013.05.30
申请号 JP20110248109 申请日期 2011.11.11
申请人 DAIHEN CORP 发明人 SADO DAISUKE;KAMIYA SHINJI
分类号 H01L21/677;B65G49/06 主分类号 H01L21/677
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