| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat radiation component which has a high heat conductivity and has a good heat radiation property, a semiconductor package containing the heat radiation component, and a method for manufacturing the same. <P>SOLUTION: The heat radiation component 1 includes a heat radiation board 10 which contains a recess 10x and a first through hole 10y connecting an outside surface and a bottom surface of the recess 10x, a linear heat conductive substance formed so as to protrude in many numbers from the bottom surface of the recess 10x, and a metal layer 22 which covers a tip end of the linear heat conductive substance while extending at least at a part of a formation surface of the recess 10x where the recess 10x is formed and has a semiconductor element contact region which contacts to a semiconductor element on an opposite surface of the surface facing the bottom surface of the recess 10x. When viewed vertically to the opposite surface, on the outside of the semiconductor element contact region of the metal layer 22, a second through hole is formed which connects the opposite surface and a surface facing the bottom surface of the recess 10x. <P>COPYRIGHT: (C)2013,JPO&INPIT |
